Desoldering Pump

Features 

  • Light Weight design
  • Strong function, high efficiency.
  • Unique crushed tin, easy to remove the suction nozzle tin crumbs.
  • Applicable to aany remove tin requirement. 
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FAQs

It’s designed to remove molten solder from PCB pads and component leads—ideal for repairs, re-work or removal of through-hole components.

According to the product page: a lightweight design, strong function/high efficiency, and a unique crushed-tin nozzle for easy removal of tin crumbs.

  • Material: Steel.

  • Length: 210 mm.

  • Weight: approx. 25 g.

  • Model number: JAS 2201.

The listing doesn’t explicitly state maximum temperature or compatibility with lead-free solder. It’s best to verify with the supplier whether the pump can handle the higher melting points of lead-free solder before using for that purpose.

Since the pump has a “unique crushed tin, easy-to-remove suction nozzle tin crumbs” feature, you should periodically clear out any solder residue from the nozzle and chamber to maintain suction efficiency.

It is offered by Blue Sky System Pvt. Ltd., Delhi, India. The component is listed as “Made in India”.

The product page does not specify warranty details. It’s advisable to ask the supplier at the time of purchase about warranty coverage, spare nozzle availability, and whether replacement parts (like springs or washers) are supported.

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